|
¹øÈ£ |
»çÁø |
Àåºñ¸í |
ºÐ·ù |
Àåºñº¸±â |
¿¹¾à½Åû |
32 |
 |
E-SEM |
INSPECTION |
 |
 |
31 |
 |
Electroforming Machine |
DEPOSITION |
 |
 |
30 |
 |
PECVD II |
DEPOSITION |
 |
 |
29 |
 |
LPCVD3 (LTO) |
DEPOSITION |
 |
 |
28 |
 |
LPCVD4 (Low Stress Nitride) |
DEPOSITION |
 |
 |
27 |
 |
RIE II |
ETCHING |
 |
 |
26 |
 |
񃧯Charge |
OTHERS |
 |
 |
25 |
 |
FURNACE 2 |
DEPOSITION |
 |
 |
24 |
.JPG) |
LPCVD5(Poly) |
DEPOSITION |
 |
 |
23 |
 |
Multi Sputter |
DEPOSITION |
 |
 |
22 |
 |
°ø°£»ç¿ë·á |
OTHERS |
 |
 |
21 |
 |
E-beam Lithography |
PHOTO_LITHOGRAPHY |
 |
 |
20 |
 |
wafer Á¦°ø |
OTHERS |
 |
 |
19 |
 |
Ion Milling |
ETCHING |
 |
 |
18 |
 |
»ç¹°ÇÔ |
OTHERS |
 |
 |
17 |
 |
E-Beam Evaporator II |
DEPOSITION |
 |
 |
16 |
 |
RIE¥² |
ETCHING |
 |
 |
15 |
 |
Spin Coater3 |
PHOTO_LITHOGRAPHY |
 |
 |
14 |
 |
½Ã¾à¾ÈÀüº¸°üÇÔ |
OTHERS |
 |
 |
13 |
 |
À¯±â½Ã¾àº¸°üÇÔ |
OTHERS |
 |
 |
|